| 摘要 |
The invention relates to a modularly constructed electrical component having a module substrate preferably made of Si and having one or more preferably unhoused chips, which are placed on this module substrate while being electrically connected thereto, and which are each joined to the module substrate, e.g. by means of direct wafer bonding. A recess is provided in the module substrate so that a closed hollow space is formed when the chip is joined to the module substrate. The hollow space is not formed by a protective cap, which surrounds the chip and, with the module substrate, closes it on all sides, rather it is formed by the joining of opposing contact areas of the chip underside and of the upper side of the module substrate. The inventive component can be economically produced due to the fact that it does not require a protective cap for creating the hollow space. The invention is also advantageous compared to a monolithic integration of the functional units due to its higher yield. |
