MANUFACTURING METHOD FOR MULTILAYERED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayered wiring board by which a high-density and fine wiring pattern with a flat surface can be obtained using a semi-additive method by establishing the inter-layer connection of a high-density wiring board by using conductive paste. SOLUTION: An insulating resin layer (5) supported by a copper layer (4) and the copper layer (4) supported by an outermost separable film (3) are layered sequentially on a core board (1) having an inner wiring layer (2) on the surface thereof. Via-holes (6) are formed to extend from the film (3) to reach the inner wiring layer (2) at prescribed spots using laser beams. The via-holes (6) are then filled with the conductive paste (7), and thereafter the film (3) is separated to make the conductive paste (7) cured to form a via. COPYRIGHT: (C)2005,JPO&NCIPI