发明名称 Methods for fabrication of a polishing article
摘要 Methods are provided for forming a conductor for use in electrochemical mechanical polishing. In one aspect a method is provided for processing a substrate including providing a substrate having a conductive surface, depositing a resist material on the conductive surface, patterning the resist layer to expose portions of the conductive surface, and depositing a metal layer on the exposed portions of the conductive surface by an electrochemical deposition technique.
申请公布号 US2005178666(A1) 申请公布日期 2005.08.18
申请号 US20050034225 申请日期 2005.01.12
申请人 APPLIED MATERIALS, INC. 发明人 TSAI STAN D.;WALDENSWEILER RALPH;HU YONGQI;CHEN LIANG-YUH;OLGADO DONALD J.K.
分类号 B23K5/08;C25D5/02;C25D5/34;C25D7/00;C25D7/12;C25D17/14;C25F7/00;(IPC1-7):C25D5/02 主分类号 B23K5/08
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