发明名称 |
Methods for fabrication of a polishing article |
摘要 |
Methods are provided for forming a conductor for use in electrochemical mechanical polishing. In one aspect a method is provided for processing a substrate including providing a substrate having a conductive surface, depositing a resist material on the conductive surface, patterning the resist layer to expose portions of the conductive surface, and depositing a metal layer on the exposed portions of the conductive surface by an electrochemical deposition technique.
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申请公布号 |
US2005178666(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
US20050034225 |
申请日期 |
2005.01.12 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TSAI STAN D.;WALDENSWEILER RALPH;HU YONGQI;CHEN LIANG-YUH;OLGADO DONALD J.K. |
分类号 |
B23K5/08;C25D5/02;C25D5/34;C25D7/00;C25D7/12;C25D17/14;C25F7/00;(IPC1-7):C25D5/02 |
主分类号 |
B23K5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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