| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit module which can suppress the amount of heat transfered, from a heating component to a low heatproof component, using a simple configuration. SOLUTION: The circuit module 1 includes the heating component 3, and the low heat-proof component 4 with low heat resistance to the heat emitted from the heating component 3, provided with the configurations prepared in the direction along the substrate side of the same substrate 2 via a spacing. In the circuit module 1, a hole 6 for mitigating the heat transfer is provided for the course of the heat transfer of the heat of the substrate 2, until it results from the heating component 3 in the low heat-proof component 4. Since the thermal resistivity of the heat transfer path from the heating component 3 in the substrate 2 to the low heat-proof component 4 is increased by the hole 6 for reducing the heat transfer, the amount of the heat transfer which reaches the low heat-proof component 4 from the heating component 3 can be suppressed, and heat damage to the low heat-proof component 4, resulting from the heat of the heating component 3, can be suppressed. COPYRIGHT: (C)2005,JPO&NCIPI
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