Process for preparing low dielectric constant material

摘要

A process for preparing a low dielectric constant material comprising heat-treating a compound containing a borazine skeleton structure of the formula: wherein at least one of R₁ to R₆ is a bond which binds said borazine skeleton structure to a molecule of a inorganic or organic compound, and/or R₁ to R₆ are independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group, a substituted aryl group, an alkenyl group, an amino group, an alkylamino group, an alkoxyl group, a thioalkoxyl group, a carbonyl group, a silyl group, an alkylsilyl group, a phosphino group, an alkylphosphino group or a group of the formula: Si(OR₇)(OR₈)(OR₉), and at least one of R₁ to R₆ is not a hydrogen atom.