发明名称 |
Microsystem enclosure and method of hermetic sealing |
摘要 |
A microsystem enclosure for hermetically sealing and thereby protecting a microsystem located on a substrate from the potentially damaging effects of exposure to moisture, dust, and other external environmental or operating conditions. The enclosure broadly comprises a single-piece hermetic cover structure and a single solder preform. The preform facilitates sealing the cover to the substrate in high-temperature, single-step process so as to create a hermetic cavity wherein the microsystem resides.
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申请公布号 |
US2005178820(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
US20050079985 |
申请日期 |
2005.03.15 |
申请人 |
MORGENSTERN HOWARD;KAUTZ DAVID;BLAZEK ROY J. |
发明人 |
MORGENSTERN HOWARD;KAUTZ DAVID;BLAZEK ROY J. |
分类号 |
B23K31/02;H01L23/10;H01L23/28;(IPC1-7):B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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