RESIN COMPOSITION FOR GHZ-BAND ELECTRONIC COMPONENT AND GHZ-BAND ELECTRONIC COMPONENT

摘要

Disclosed is a resin composition for GHz-band electronic components which contains at least one resin selected from the group consisting of thermoplastic resins, curing resins and composite resins of a thermoplastic resin and a curing resin, and a nanoscale carbon tube. The nanoscale carbon tube is contained in the resin composition in an amount of 0.0001-0.4 weight % relative to the resin contained in the composition. Also disclosed is an electronic component produced from such a resin composition.