| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a printed-wiring board in which a working such as the roughening treatment of a conductor circuit is not necessarily required and which has excellent electrical characteristics, inhibits the dispersion of a wiring and the generation of a fault, has a superior moisture-absorption heat resistance or the like, and equalizes the thickness of an insulating resin layer. SOLUTION: The manufacturing method for the printed-wiring board has a process in which a resin layer is formed on the surface of a core board, to which the conductor circuit is formed by a thermosetting resin composition containing polyamide-imide and the surface of the core board is smoothed. COPYRIGHT: (C)2005,JPO&NCIPI |
