发明名称 PACKAGE FOR PIEZOELECTRIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a package for a piezoelectric device in which the package is not damaged even when a laser beam to be irradiated in order to fuse a sealing material is deviated from a sealing hole. SOLUTION: When the sealing hole (through hole) 20 formed on the package 10 for the piezoelectric device is a step hole consisting of a first through hole 20a of a small diameter which has an aperture part on the inside of the package 10 and a second through hole 20b of a large diameter which has an aperture part on the outside of the package 10, metallized parts 24, 25 are formed on a step part which is a connection part between the first and second through holes 20a, 20b and suitable for the step hole, the inwall part of the second through hole 20b and the outer edge of the aperture part of the second through hole 20b. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005223612(A) 申请公布日期 2005.08.18
申请号 JP20040029497 申请日期 2004.02.05
申请人 SEIKO EPSON CORP 发明人 HIRASAWA NORIYA
分类号 H01L23/02;H03H9/02;H03H9/10;(IPC1-7):H03H9/02 主分类号 H01L23/02
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