| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer of SOS, SOQ, or the like and a method of manufacturing the same which do not cause warpage or fracture with a simple manufacturing process and perform accurate positioning with an optical sensor. SOLUTION: The semiconductor wafer is constituted of a translucent insulating substrate which has a slit for positioning on its periphery and made of sapphire and so on, and a silicon thin film which is formed over one surface of the insulating substrate. In the semiconductor wafer, ion is implanted to a region including the slit on the periphery of the silicon thin film to make silicon amorphous. Thus, translucency is eliminated on a point having been made amorphous, and accurate positioning can be performed with a conventional optical sensor. COPYRIGHT: (C)2005,JPO&NCIPI
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