FOLDED STRUCTURE OF FPC SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To structure easily a three-dimensional shape with high flexibility in forming a circuit conductor 4, in relation to the bending structure of a FPC substrate wherein the three-dimensional shape is formed by bending the flat-surface FPC substrate 1 at the position of a folded line 5. SOLUTION: The FPC substrate 1 consists of an insulated flat surface 3 in which the circuit conductor 4 is formed. It has such a structure that the three-dimensional shape may be formed by bending the flat-surface FPC substrate 1 at the position of the folded line 5. The folded line 5 comprises pores 11 of a predetermined size arranged in order by the line. COPYRIGHT: (C)2005,JPO&NCIPI