| 摘要 |
PROBLEM TO BE SOLVED: To enable accurate resin molding by preventing the trouble of a wire touching or the like such that a release film is peeled from the surface of a mold or slackened to come into contact with a product to be molded when the product to be molded is molded from a resin using the release film. SOLUTION: After the release film 10 is attracted to the inner surface of the cavity of the mold under vacuum, the cavity is evacuated and the cavity is filled with the resin to mold the product 50 to be molded. In this resin molding method, the degree of vacuum in the cavity 80 is set to a degree of vacuum not peeling the release film 10 from the inner surface of the cavity when the cavity is evacuated to mold the resin. COPYRIGHT: (C)2005,JPO&NCIPI
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