COMPOSITE MATERIAL FOR SUBSTRATES AND CIRCUIT BOARD USING IT

摘要

PROBLEM TO BE SOLVED: To provide a composite material for a substrate which is low in hygroscopicity and high in peel strength in a laminate between a liquid crystal polymer film having enough heat resistance to soldering and copper foil and can be converted into a fine pattern and a circuit board using the composite material. SOLUTION: In the composite material for the substrate, the surface-treated copper foil having a roughened surface 2.5-4.0μm in surface roughness Rz and 25 or below in brightness by bonding roughening particles to at least one side of the copper foil and the insulating substrate containing at least 50% of a thermoplastic liquid crystal polymer are laminated. Projections by the roughening particles are preferably distributed approximately uniformly so that 6-35 projections 1-5μm high are distributed in a range of an observation cross section of 25μm. COPYRIGHT: (C)2005,JPO&NCIPI