| 发明名称 |
Semiconductor copper bond pad surface protection |
| 摘要 |
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
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| 申请公布号 |
US2005181191(A1) |
申请公布日期 |
2005.08.18 |
| 申请号 |
US20050084985 |
申请日期 |
2005.03.21 |
| 申请人 |
KULICKE & SOFFA INVESTMENTS, INC |
发明人 |
ELLIS TIMOTHY W.;MURDESHWAR NIKHIL;ESHELMAN MARK A.;RHEAULT CHRISTIAN |
| 分类号 |
H01L21/48;H01L21/60;H01L23/485;H01L23/498;H05K3/28;(IPC1-7):B32B3/00;B32B15/00;B32B15/04 |
主分类号 |
H01L21/48 |
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