发明名称 Method of manufacturing silicon carbide semiconductor device
摘要 Stress is exerted to the SiC crystal in the region, in which the carriers of a SiC semiconductor device flow, to change the crystal lattice intervals of the SiC crystal. Since the degeneration of the conduction bands in the bottoms thereof is dissolved, since the inter-band scattering is prevented from causing, and since the effective electron mass is reduced due to the crystal lattice interval change, the carrier mobility in the SiC crystal is improved, the resistance of the SiC crystal is reduced and, therefore, the on-resistance of the SiC semiconductor device is reduced.
申请公布号 US2005181536(A1) 申请公布日期 2005.08.18
申请号 US20050042809 申请日期 2005.01.25
申请人 FUJI ELECTRIC HOLDINGS CO., LTD. 发明人 TSUJI TAKASHI
分类号 H01L21/00;H01L21/04;H01L29/04;H01L29/15;H01L29/24;H01L29/267;H01L29/78;H01L31/0312;(IPC1-7):H01L29/15;H01L31/031 主分类号 H01L21/00
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