发明名称 Structure of fan devices for leading out wires
摘要 A lead wire is led out to a fan outer frame portion side through a lead wire retaining portion that is provided to a motor support portion of a housing that fixes a fan motor so as to protrude to a fan outer frame portion side or is provided to the fan outer frame portion of the housing so as to protrude to the motor support portion side. The lead wire retaining portion is positioned between neighboring support beams for fixing the motor support portion to the fan outer frame portion.
申请公布号 US2005180867(A1) 申请公布日期 2005.08.18
申请号 US20040953450 申请日期 2004.09.30
申请人 NIDEC CORPORATION 发明人 TAKAHASHI SHUJI;INOUE TOMOYUKI
分类号 F04D29/00;F04B17/00;F04B35/04;F04D25/08;G06F1/20;H02K5/22;(IPC1-7):F04B17/00 主分类号 F04D29/00
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