发明名称 |
Electronic component mounting apparatus |
摘要 |
The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.
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申请公布号 |
US2005177998(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
US20050054625 |
申请日期 |
2005.02.10 |
申请人 |
HITACHI HIGH-TECH INSTRUMENTS CO., LTD. |
发明人 |
FUKUSHIMA YOSHIHARU;NAGATA TAKAHIRO;SETO KATSUYUKI |
分类号 |
H05K13/04;(IPC1-7):B23P19/00 |
主分类号 |
H05K13/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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