| 摘要 |
PROBLEM TO BE SOLVED: To provide a filler material which is superior in filling properties into a through-hole and in adhesiveness to other layers, where fillers are not oriented and which does not have bias in the coefficient of thermal expansion and the like and is thermally stable, and a wiring substrate, and to provide a manufacturing method for them. SOLUTION: A filler material contains two or more kinds of inorganic fillers including calcium carbonate powder, thermosetting resin, and a hardening agent. The calcium carbonate powder is composed of at least one of crushed, spherical, cubic, and spindle-shaped particles. A wiring substrate (100) comprises a base layer (1) having a through-hole (11), fillers (2) which are composed of hardened substances of filler material (21) and fill the through-hole, and conductor layers (3) which cover surfaces of the fillers (2) exposed on opening surfaces of the through-hole. This manufacturing method has a process of charging the filler material (21) into the base through-hole (11), a process of hardening the charged filler material (21), to produce the filler (2), and a process of forming conductor layers (3) so that they cover surfaces of the fillers (2) exposed on surfaces of the base layer (1). COPYRIGHT: (C)2005,JPO&NCIPI
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