| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package for alleviating the difficulty in which the number of layers of a printed board is increased because the lead wiring part of a semiconductor package is highly densified. <P>SOLUTION: Connection terminals 20, 21 are provided on the surface and rear surface of a semiconductor chip 10, to which buildups 30, 31 on the surface and the rear surface are connected respectively, and the buildups 30, 31, the printed boards 50, 51, and external terminals 40, 41 are connected respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
