| 摘要 |
PROBLEM TO BE SOLVED: To provide a temporary placement base for positioning which can perform accurate alignment of circular semiconductor substrates, having different diameters. SOLUTION: The temporary placement base 1 comprises a cylindrical sidewall 2, whose inside diameter gradually increases from a bottom part 3 toward an upper opening edge 4, and the hollowed-out bottom part 3. The cylindrical sidewall 2 has a small bottom shelf 5, whose outside diameter is a diameter of a semiconductor substrate having a smaller diameter, and a large bottom shelf 6 whose inside diameter is larger than the diameter of the semiconductor substrate, having a smaller diameter and whose outside diameter is a diameter of a semiconductor substrate having a large diameter. A wall line, connecting the outer circumference 5a of the small bottom shelf and the inner circumference 6b of the large bottom shelf has a slopeαand a wall line connecting the outer circumference 6a of the large bottom shelf 6, and the inner circumference 4b of the upper opening edge has slopesβ, andαandβhave slopes of 60°to 70°. A fifth to a quarter of the cylindrical sidewall 2 is cut out from up to down, forming an entrance 7 having such a width as to allow the arm of a transfer robot for supporting a suction pad which can suck the surface of the semiconductor substrate to move in the vertical directions. COPYRIGHT: (C)2005,JPO&NCIPI |
