| 发明名称 |
Method of fabricating passivation layer for organic devices |
| 摘要 |
Provided is a method of fabricating a passivation layer for an organic device, including: forming the organic device on a substrate; and forming a passivation layer on the organic device. Here, forming the passivation layer on the organic device includes forming an inorganic thin film by thin film deposition using pulsed plasma.
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| 申请公布号 |
US2005181535(A1) |
申请公布日期 |
2005.08.18 |
| 申请号 |
US20050059854 |
申请日期 |
2005.02.16 |
| 申请人 |
YUN SUN J.;LIM JUNG W.;KO YOUNG W.;LEE JIN H. |
发明人 |
YUN SUN J.;LIM JUNG W.;KO YOUNG W.;LEE JIN H. |
| 分类号 |
H01L51/00;H01L51/30;H01L51/52;(IPC1-7):H01L21/00;H01L21/44;H01L51/40 |
主分类号 |
H01L51/00 |
| 代理机构 |
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