发明名称 |
MULTILAYER PRINTED WIRING BOARD |
摘要 |
Disclosed is a package board wherein a malfunction or error occurs even when a high-frequency IC chip, in particular an IC chip of more than 3 GHz is mounted. A conductor layer (34P) having a thickness of 30 mum is formed on a core substrate (30), and a conductor circuit (58) having a thickness of 15 mum is formed on a interlayer resin insulating layer (50). By forming the conductor layer (34P) thick, the volume of the conductor itself is increased, thereby reducing the resistance. In addition, the power supply capacity to the IC chip can be improved by using the conductor layer (34) as a power supply layer. |
申请公布号 |
WO2005076683(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
WO2005JP01611 |
申请日期 |
2005.02.03 |
申请人 |
IBIDEN CO., LTD.;INAGAKI, YASUSHI;SANO, KATSUYUKI |
发明人 |
INAGAKI, YASUSHI;SANO, KATSUYUKI |
分类号 |
H01L21/48;H01L21/60;H01L23/498;H01L23/50;H01L23/538;H01L23/66;H05K1/02;H05K1/11;H05K1/18;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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