| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device which enables strong electrical connection of a semiconductor element to an external element using an external connection electrode and miniaturizes the semiconductor device, and also to provide a manufacturing method for the semiconductor device. <P>SOLUTION: The semiconductor element 12 is mounted on the surface 10a of a wiring board 10, and is sealed with a sealing resin 18 to form the semiconductor device 1. The wiring board 10 of the semiconductor device 1 has: a cutout 30A which is formed on the side of the back face 10b of the wiring board 10; the external connection electrode 34A which is formed to extend from the inner wall surface 32A of the cutout 30A to the back face of the wiring board 10; a first conductive passage 24A which penetrates from the front face of the wiring board 10 opposite to the back face, to the inner wall surface 32A of the cutout 30A to connect the front face electrically to the external connection electrode 34A; and a second conductive passage 24A which penetrate from the front face to the back face to connect the front face electrically to the external connection electrode 34A. The semiconductor element 12 is connected electrically to the first and second conductive passages 24A. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
