| 摘要 |
PROBLEM TO BE SOLVED: To provide the inspecting method of a semiconductor device, its inspecting device, its inspection program, and its inspecting device which can inspect the semiconductor device by exactly contacting with an electrode even when the tip of a probe is worn, or displaced from a predetermined position. SOLUTION: The inspection method comprises the steps of provisionally aligning a probe card with the semiconductor device (step S52), checking open-circuit/short-circuit of all electrodes (step S53), shifting the semiconductor device in +X direction byΔX (step S55), checking the open-circuit/short-circuit again (step S56), and repeating the steps S55-S58 until the open-circuit or the short-circuit is detected in a step S58. Therefore, the conductive region of X direction is fixed by treating the same processes in -X direction, and the center position of the region becomes a position Xc which has the highest value in margin with respect to the displacement of the probe tip in X direction. COPYRIGHT: (C)2005,JPO&NCIPI
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