发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device with a copper wiring inhibiting the shortening of a lifetime due to an EM fault and an SM fault and having a high reliability. SOLUTION: The semiconductor device has a wiring layer composed of copper or a copper alloy containing oxygen and chlorine in a mean concentration of 1.0×10<SP>16</SP>to 2.0×10<SP>18</SP>atoms/cm<SP>3</SP>respectively. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005223059(A) 申请公布日期 2005.08.18
申请号 JP20040028098 申请日期 2004.02.04
申请人 TOSHIBA CORP 发明人 HASUNUMA MASAHIKO;TOYODA HIROSHI;YAHIRO KAZUYUKI
分类号 H01L21/3205;H01L23/52;(IPC1-7):H01L21/320 主分类号 H01L21/3205
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