发明名称 |
Curable epoxy compositions, methods and articles made therefrom |
摘要 |
A curable epoxy formulation comprises an epoxy monomer, an epoxy oligomer, or a combination thereof; an organofunctionalized colloidal silica; a cure catalyst; and optional reagents. Further embodiments of the present invention include a method for making the curable epoxy formulation and a semiconductor package comprising the curable epoxy formulation. Embodiments of cured formulations can have low coefficients of thermal expansion and/or high glass transition temperatures.
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申请公布号 |
US2005181214(A1) |
申请公布日期 |
2005.08.18 |
申请号 |
US20040006265 |
申请日期 |
2004.12.07 |
申请人 |
CAMPBELL JOHN ROBERT;RUBINSZTAJN SLAWOMIR;SCHATTENMANN FLORIAN JOHANNES;TONAPI SANDEEP SHRIKANT;PRABHAKUMAR ANANTH;WOO WING-KEUNG;ANOSTARIO JOSEPH MICHAEL;SHERMAN DONNA MARIE |
发明人 |
CAMPBELL JOHN ROBERT;RUBINSZTAJN SLAWOMIR;SCHATTENMANN FLORIAN JOHANNES;TONAPI SANDEEP SHRIKANT;PRABHAKUMAR ANANTH;WOO WING-KEUNG;ANOSTARIO JOSEPH MICHAEL;SHERMAN DONNA MARIE |
分类号 |
C01B33/149;C08L63/00;H01L21/56;H01L23/29;(IPC1-7):B32B27/38 |
主分类号 |
C01B33/149 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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