| 发明名称 |
Method of forming wiring |
| 摘要 |
A method for forming via holes includes placing an insulating layer on a first wiring layer, forming opening portions in the insulating layer, and forming a second wiring layer on the insulating layer. At the time of forming the opening portions, the insulating layer is irradiated with a laser beam with the focus position staggered. |
| 申请公布号 |
US2005181597(A1) |
申请公布日期 |
2005.08.18 |
| 申请号 |
US20050099000 |
申请日期 |
2005.04.05 |
| 申请人 |
YANAGISAWA YOSHIYUKI;IWAFUCHI TOSHIAKI |
发明人 |
YANAGISAWA YOSHIYUKI;IWAFUCHI TOSHIAKI |
| 分类号 |
H01L21/28;G09F9/33;H01L21/302;H01L21/48;H01L21/68;H01L21/768;H01L23/31;H01L25/075;H01L33/00;H01L33/20;H01L33/24;H01L33/32;H01L33/38;H01L33/40;H01L33/48;H01L33/54;H01S3/00;H05K3/00;(IPC1-7):H01L21/00;H01L21/476 |
主分类号 |
H01L21/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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