发明名称 Verfahren und Vorrichtung zum Anbringen einer Abdeckung auf einem Substrat und Verfahren und Vorrichtung zum Aufbringen eines Dichtungsmittels auf eine Komponente
摘要 A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant.
申请公布号 DE10011008(B4) 申请公布日期 2005.08.18
申请号 DE2000111008 申请日期 2000.03.07
申请人 MURATA MFG. CO., LTD. 发明人 HIGUCHI, MASATO;HIRAKAWA, ATSUSHI;MAESAKA, MICHINOBU
分类号 B05D1/28;B05C3/20;B05D5/02;H01L21/50;(IPC1-7):B05D1/28 主分类号 B05D1/28
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