发明名称 |
Verfahren und Vorrichtung zum Anbringen einer Abdeckung auf einem Substrat und Verfahren und Vorrichtung zum Aufbringen eines Dichtungsmittels auf eine Komponente |
摘要 |
A method for applying a sealant to a component, in which the sealant is applied to a part of or the entirety of a sealing surface of the component, comprises the steps of: disposing in the sealant, an abutting member approximately in parallel to a surface of the sealant, which is a liquid, formed into a film of a specified thickness; pressing the sealing surface of the component to the abutting member in the sealant formed into the film; and transferring the sealant to the sealing surface of the component by pulling the component apart from the sealant. |
申请公布号 |
DE10011008(B4) |
申请公布日期 |
2005.08.18 |
申请号 |
DE2000111008 |
申请日期 |
2000.03.07 |
申请人 |
MURATA MFG. CO., LTD. |
发明人 |
HIGUCHI, MASATO;HIRAKAWA, ATSUSHI;MAESAKA, MICHINOBU |
分类号 |
B05D1/28;B05C3/20;B05D5/02;H01L21/50;(IPC1-7):B05D1/28 |
主分类号 |
B05D1/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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