Circuit board surface mount package

摘要

An electronic package (10) is provided having a surface mount electronic device (40) connected to a circuit board (12). The package (10) includes a circuit board (12) and a surface mount electronic device (40). A mounting pad (28) is formed on the circuit board (12). A plurality of vias (30) are formed each having an opening extending into the circuit board (12) and extending through the mounting pad (28). The package (10) further includes a solder joint (32) connecting a contact terminal (42) of the surface mount device (40) to the mounting pad (28) on the circuit board (12). The solder joint (32) extends at least partially into the openings in each of the plurality of vias (30) to support the arrangement of the surface mount device (40) on the circuit board (12).