| 摘要 |
An optoelectronic assembly having a heat sink, and in particular to an optical receiver or transmitter unit for use in an optical fibre communication system in which a heat sink is provided to carry away heat generated by electrical components within the unit. The optoelectronic assembly comprises an optical transceiver unit, a heat sink and a housing. The optical transceiver unit has an interior containing at least one optoelectronic device with at least one electrical connection to said device for providing electrical power to the device, the electrical connection being made through an electrical contact on an external surface of the optical transceiver unit. The heat sink is mounted to the optical transceiver unit and is in thermal contact with both the optical transceiver unit and the housing to convey waste heat from within the optical transceiver unit to the housing. The heat sink has at least one conductive electrical path, the path extending between the electrical contact on the external surface of the transceiver unit to a connection terminal by which electrical power may be supplied to the optoelectronic device. |
