| 摘要 |
<p>PROBLEM TO BE SOLVED: To visually inspect with accuracy the connection state between a bump and a board-side terminal conductive-connected to it without decomposition, related to a mounting structure for a semiconductor chip which uses a board-side terminal or a wiring board with low transparency. SOLUTION: This is a mounting structure wherein a semiconductor chip 11 is conductively by bonded to a wiring board 13 of low transparency using an ACF(anisotropic conductive film) 12. A dummy bump 22 is formed at a joint surface of the semiconductor chip 11, and a dummy terminal 23A is formed at the joint surface of the wiring board 13 with the dummy terminal 23A smaller in area than the dummy bump 22 and a board-side terminal 17. At a place of dummy bump 22 positioned outside the dummy terminal 23A, the state of ACF12, for example presence of air bubbles or appropriate number of conductive particles, etc., is visually confirmed for grasping the conductive connection state between the board-side terminal 17 and the bump 14.</p> |
