发明名称 |
MODULE PART |
摘要 |
A module component is provided having a sufficient shield effect and fabricated low in height. <??>On a circuit board (10), a mount device (30) comprising an electronic part is mounted, and this mount device (30) is sealed with a sealing body (40). On the surface of this sealing body (40), a metal film (20) is formed. A ground pattern (50) is formed at the outer periphery of the principal surface of the circuit board (10), and a configuration is formed in which said metal film (20) is conductively connected with the ground pattern (50). <IMAGE> |
申请公布号 |
EP1450400(A4) |
申请公布日期 |
2005.08.17 |
申请号 |
EP20030791264 |
申请日期 |
2003.08.25 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TSUNEOKA, MICHIAKI;HASHIMOTO, KOJI;HAYAMA, MASAAKI;YASUHO, TAKEO |
分类号 |
H05K9/00;H01L23/00;H01L23/13;H01L23/31;H01L23/552;H05K1/02;H05K3/00;H05K3/28;H05K3/40 |
主分类号 |
H05K9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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