| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a chip scale package which is capable of packaging a chip in a package which is nearly as large as the chip by a method, wherein a printed circuit board is composed of a conductor layer having a viahole bored by a laser beam and a built-up conductor layer possessed of a photo-via of photosensitive resin. SOLUTION: A semiconductor package printed circuit board is equipped with a first conductor layer, formed of a metal body (electroplating copper) 5 located inside and on laser vias 3 provided to an insulating resin layer 2. Photo-vias 7 provided to a photosensitive insulating resin layer 6 formed on the insulating resin layer 2 are electrolessly plated 8 to form a second conductor layer. An anisotropically conductive film 11 is provided onto the insulating resin layer 2 and the first conductor layer. By this setup, a chip scale package which is capable of packaging a chip in a package nearly as large as the chip, so that a small-sized package with 14mm square and having 192 pins can be realized.</p> |
