发明名称 |
Method for fabricating surface acoustic wave filter package |
摘要 |
A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.
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申请公布号 |
US6928719(B2) |
申请公布日期 |
2005.08.16 |
申请号 |
US20020119708 |
申请日期 |
2002.04.11 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM TAE HOON;PARK CHAN WANG;PARK JOO HUN;KIM JONG TAE |
分类号 |
H01L23/29;H01L23/31;H03H3/08;H03H9/02;H03H9/25;H03H9/64;(IPC1-7):H04R31/00;H05K3/28 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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