发明名称 |
Semiconductor device and method for manufacturing the same |
摘要 |
There is provided a semiconductor device in which a plurality of semiconductor chips is stacked in layers and sealed in a package, including: a lower-layer semiconductor chip which is mounted on a package board; an upper-layer semiconductor chip which is stacked via a plurality of spacers on the lower-layer semiconductor chip; at least one first conductor interconnecting electrically at least one first electrode on the lower-layer semiconductor chip and at least one first internal terminal on the package board; at least one second conductor electrically interconnecting at least one second electrode on the upper-layer semiconductor chip and at least one second internal terminal on the package board; and the package for sealing therein the lower-layer semiconductor chip, the upper-layer semiconductor chip, and the at least one first conductor and the at least one second conductor which are all on the package board.
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申请公布号 |
US6930396(B2) |
申请公布日期 |
2005.08.16 |
申请号 |
US20030405471 |
申请日期 |
2003.04.03 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
KURITA YOICHIRO;SHIRONOUCHI TOSHIAKI;TETSUKA TAKASHI |
分类号 |
H01L25/18;H01L25/065;H01L25/07;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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