| 摘要 |
A method and apparatus for manufacturing an electrical connection unit and connector array is provided. Such arrays may be used to solder together traces from opposed circuit boards, in which the array is fitted between, and soldered to the boards to complete a circuit. The method of manufacturing a connection unit includes providing a first insulative base with one or more contacts or contact groups extending from the first side towards the second side of the base. Solder portions or solder balls may be reflowed to contacts at their termination points. An apparatus and method may provide a solder positioning device or means on top of or adjacent to the first insulative base, so that solder portions or solder balls are placed within cavities in the positioning device, in alignment with apertures of the first insulative base. The connection unit may be heated to reflow and fuse the solder portions to the contact termination, thereby constructing an array.
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