| 发明名称 |
Sheet material especially useful for circuit boards |
| 摘要 |
A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.
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| 申请公布号 |
US6929848(B2) |
申请公布日期 |
2005.08.16 |
| 申请号 |
US20020227998 |
申请日期 |
2002.08.26 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
SAMUELS MICHAEL R.;KHAN SUBHOTOSH;LEVIT MIKHAIL R. |
| 分类号 |
B32B5/24;B29B13/10;B32B5/28;B32B15/14;B32B27/12;D04H1/00;D04H13/00;H01L23/14;H05K1/03;(IPC1-7):B32B3/00;B32B5/06 |
主分类号 |
B32B5/24 |
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