| 摘要 |
<P>PROBLEM TO BE SOLVED: To fix an IC chip onto a sheet base material without the use of an adhesive, and to prevent the IC chip from protruding on the sheet base material. <P>SOLUTION: The IC chip 10 is mounted on a resin sheet 2 which is to be turned into a strip-shaped resin layer by being cut. After that, laser light is applied to at least an area, equipped with the IC chip 10, from the side of a surface, on the opposite side of a surface equipped with the IC chip 10, of the resin sheet 2, while the IC chip 10 is pressurized against the resin sheet. Thus, the area, equipped with the IC chip 10, of the resin sheet 2 is melted, and the IC chip 10 is embedded in the resin sheet 2 and fixedly attached to it. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
