| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a highly reliable multilayer wiring board which is ensured of interlayer connection with excellent productivity. SOLUTION: The multilayer wiring board is composed by solder-joining a wiring pattern 106, a conductor I for electric connection composed of a conductor post 104 formed on the wiring pattern, a connection layer 110 having a solder layer 105 formed on the tip surface of the conductor post, and a connected layer 120 having a conductor II for the electric connection composed of a land 107 for the interlayer connection disposed corresponding to the conductor post. In the manufacturing method, these layers are soldered for connection through an adhesive material layer 108. The adhesive material layer is a negative type photosensitive adhesive material. COPYRIGHT: (C)2005,JPO&NCIPI |
