发明名称 DEVICE AND METHOD FOR FORMING VACUUM
摘要 PROBLEM TO BE SOLVED: To provide vacuum forming device/method with which flatness is maintained, resin is sealed and forming quality can be improved without occurrence of a void in the narrow sealing space of a work and without sealing resin foaming. SOLUTION: In a vacuum chamber 8, liquid resin 13 heated to a prescribed temperature under a gel temperature is applied to the work 4 from a dispenser 11. The vacuum chamber 8 is vacuum-broken, fluid pressure is applied and the work 4 is sealed. The sealed work 4 is taken out from the vacuum chamber 8 and is carried into a pressurization shaping part 3. The work is heated and pressurized at the temperature exceeding gelling, and the work is shaped while curing of liquid resin 13 is promoted. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005217006(A) 申请公布日期 2005.08.11
申请号 JP20040019630 申请日期 2004.01.28
申请人 APIC YAMADA CORP 发明人 NAKAZAWA HIDEAKI;KOBAYASHI KAZUHIKO;MIYAGAWA TSUTOMU
分类号 B29C39/10;B29C39/42;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C39/10
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