| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for accommodating semiconductor element which can successfully connect bonding wires to all wiring conductors with higher efficiency under the uniform working conditions. SOLUTION: A plated conductor layer 20 is formed by sequentially forming the non-electrolytic copper plating and the electrolytic copper plating, and is deposited to a first wiring conductor layer 11 electrically connected with a bonding wire 19. Moreover, a conductor layer 22 formed of electrolytic copper plating is also deposited to a second wiring conductor layer 12. COPYRIGHT: (C)2005,JPO&NCIPI
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