发明名称 |
Cleaning composition, method for cleaning semiconductor substrate, and process for manufacturing semiconductor device |
摘要 |
The cleaning composition which comprises organic polymer particles (A) having a crosslinked structure and a surfactant (B) and is used after chemical mechanical polishing. The cleaning method of a semiconductor substrate is a method for cleaning semiconductor substrate given after chemical mechanical polishing, by the use of the cleaning composition. The process for manufacturing a semiconductor device including a step of chemically and mechanically polishing a semiconductor substrate and a step of cleaning the semiconductor substrate obtained after the chemical mechanical polishing, by the cleaning method.
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申请公布号 |
US2005176606(A1) |
申请公布日期 |
2005.08.11 |
申请号 |
US20050052910 |
申请日期 |
2005.02.09 |
申请人 |
JSR CORPORATION |
发明人 |
KONNO TOMOHISA;KUBOTA KIYONOBU;HATTORI MASAYUKI;KAWAHASHI NOBUO |
分类号 |
B08B1/04;B08B3/08;C11D3/37;C11D11/00;H01L21/02;H01L21/306;H01L21/3105;H01L21/321;(IPC1-7):C11D1/00 |
主分类号 |
B08B1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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