Saw-strip, has two surfaces fixed to crystal piece and carrier plate, respectively, where strip cuts semi conductor disc from piece using wire saw and separates from strip by drilling holes in strip

摘要

The strip has a surface fixed to a crystal piece (1) and another surface fixed to a carrier plate. The strip cuts a semiconductor disc from the piece using a wire saw. The sawed piece, the strip and the plate are removed out of the saw, cleaned and de-cemented. Holes are drilled in the strip for separation of disc from the strip, where separation is made after the sawing operation and before cleaning and de-cementing operations. An independent claim is also included for a method for production of semi conductor discs.