| 摘要 |
PROBLEM TO BE SOLVED: To insure that so-called planarization plating is surely performed without depositing excessive plating until a plating film of a flat surface can be formed without using a costly mechanism like a film thickness monitor. SOLUTION: The plating equipment has a substrate holding section 504 for holding a substrate, a sealing material 514 for watertightly sealing the peripheral edge of a surface to be plated of the substrate held in the substrate holding section by abutting on the peripheral edge, a cathode section 506 provided with a cathode electrode 512 for energizing the substrate by coming into contact therewith, an anode 526 arranged freely vertically movably so as to face the surface to be plated of the substrate, a porous member 528 composed of a water retaining material arranged between the anode and the surface to be plated of the substrate, a constant voltage control section 552 for controlling the voltage applied between the cathode electrode and the anode constant, and a current value monitor section 554 for monitoring the current value flowing between the cathode electrode and the anode and feeding the detection signal back to the constant voltage control section. COPYRIGHT: (C)2005,JPO&NCIPI
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