发明名称 DEPOSITION METHOD, FILM, ELECTRONIC COMPONENTS, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a deposition method capable of easily and inexpensively forming a film of a prescribed pattern, the film formed by such deposition method, and electronic components and electronic equipment having such film. SOLUTION: The deposition method is a method of forming the film 3 of the prescribed pattern on a substrate 1 and comprises previously forming a high affinity region 21 having high affinity to flying objects 31 coming flying to a film forming surface side to be formed with the film 3 of the substrate 1 and a low affinity region 22 having the lower affinity to the flying objects 31 than that of the high affinity region 21 on the film forming surface of the substrate 1 at the time of forming the film 3 by using the flying objects 31, and collecting the flying objects 31 to the high affinity region 21 by utilizing the differences in affinity to the high affinity region 21 and the low affinity region 22 to the flying objects 31. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005213598(A) 申请公布日期 2005.08.11
申请号 JP20040022191 申请日期 2004.01.29
申请人 SEIKO EPSON CORP 发明人 SOGO TOMOHIKO;MIYAGAWA TAKUYA
分类号 C23C14/04;C23C16/04;(IPC1-7):C23C14/04 主分类号 C23C14/04
代理机构 代理人
主权项
地址