发明名称 METHOD FOR FORMING FILM AND FILM, ELECTRONIC PARTS AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method for easily forming a film in a prescribed pattern at a low cost, and to provide a film formed by the above method and electronic parts and an electronic apparatus having the film. SOLUTION: The method employs chemical vapor phase deposition (CVD) for forming a film 3 having a prescribed pattern on a substrate 1. In the process of evaporating a substance 31 toward the film forming face of the substrate 1 where the film 3 is to be formed and forming the film 3 by depositing the evaporated substance 31, a film forming region 21 where the film 3 is to be formed and a non-film forming region 22 where no film is to be formed are prepared on the film forming face of the substrate 1, with the non-film forming region 22 having wettability with the coming substance lower than that of the film forming region 21. Thereby, the substance 31 is collected onto the film forming region 21 by using the difference between the wettability with the substance 31 of the film forming region 21 and that of the non-film forming region 22, and the film 3 is obtained by the reaction product produced by the reaction of the evaporated substance 31. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005213597(A) 申请公布日期 2005.08.11
申请号 JP20040022190 申请日期 2004.01.29
申请人 SEIKO EPSON CORP 发明人 MIYAGAWA TAKUYA
分类号 C23C16/04;(IPC1-7):C23C16/04 主分类号 C23C16/04
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