| 摘要 |
A novel method of packaging electronic devices (105) (e.g. any device that receives or transmits electronic signals) including microelectromechanical devices, semiconductor devices, light emitting devices, light modulating devices, and light detecting device has been provided herein. The electronic device (105) is placed between two substrates (102, 110), at least one of which has a cavity for holding the electronic device. The two substrates are then bonded and hermetically sealed with a sealing medium (106). The adhesion of the healing medium (106) to the substrates, especially when one of the two substrate is ceramic, can be improved by applying a metallization layer (104) to the surface of the substrate. |
