发明名称 Method for processing an electronic part
摘要 Disclosed is a gas-generating, pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive (A) transmitting therethrough a radiation selected from the group consisting of an electromagnetic radiation, an electron radiation and an alpha radiation, and a gas generator compound (B) which generates a gas upon irradiation thereof with the radiation, wherein the gas generator compound (B) is operably combined with the pressure-sensitive adhesive (A), so that, in operation, when the gas-generating, pressure-sensitive adhesive composition which is adhered to an adherend is irradiated with the radiation, the gas generator compound (B) generates a gas and the gas effuses at an interface between the gas-generating, pressure-sensitive adhesive composition and the adherend to thereby facilitate release of the adherend from the gas-generating, pressure-sensitive adhesive composition.
申请公布号 US2005173052(A1) 申请公布日期 2005.08.11
申请号 US20050067204 申请日期 2005.02.28
申请人 ASAHI KASEI CHEMICALS CORPORATION 发明人 MITARAI YOSHIAKI
分类号 B29C65/76;C09J5/00;C09J11/06;H01L21/00;H01L21/68;(IPC1-7):B32B31/00 主分类号 B29C65/76
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