摘要 |
<p>A test module for testing the susceptibility of an integrated circuit design to latch-up, the test module comprising a plurality of test blocks (30), connected in parallel, each test block (30) comprising an injector block (12) for applying a stress current or voltage to the respective test block (30), and a plurality of sensor blocks (13) located at successively increasing distances from the respective injector block (12), each sensor block (13) comprising a PNPN latch-up test structure. The present invention combines the respective advantages of conventional IC stress current testing and latch-up parameter measurement using a standard PNPN latch-up test structure.</p> |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;SCARPA, ANDREA;CAPPON, PAUL, H.;DE JONG, PETER, C.;SMEDES, TAEDE |
发明人 |
SCARPA, ANDREA;CAPPON, PAUL, H.;DE JONG, PETER, C.;SMEDES, TAEDE |