发明名称 PRETREATING AGENT FOR ELECTROLESS PLATING, METHOD OF ELECTROLESS PLATING USING THE SAME AND PRODUCT OF ELECTROLESS PLATING
摘要 <p>A pretreating agent for electroless plating that is soluble in organic solvents and is stable; a method of electroless plating realizing excellent adhesion wherein use is made of the pretreating agent; and a product of electroless plating. Plating object is pretreated with a pretreating agent for electroless plating, comprising a noble metal soap of C5-C25 fatty acid, preferably further comprising a silane coupling agent with metal trapping capability, such as an imidazole silane coupling agent, and subjected to electroless plating. Palladium soap is preferably used as the noble metal soap.</p>
申请公布号 WO2005073431(A1) 申请公布日期 2005.08.11
申请号 WO2004JP16764 申请日期 2004.11.11
申请人 NIKKO MATERIALS CO., LTD.;KAWAMURA, TOSHIFUMI;SUZUKI, JUN;IMORI, TORU 发明人 KAWAMURA, TOSHIFUMI;SUZUKI, JUN;IMORI, TORU
分类号 C23C18/18;C23C18/28;(IPC1-7):C23C18/18 主分类号 C23C18/18
代理机构 代理人
主权项
地址