发明名称 |
PRETREATING AGENT FOR ELECTROLESS PLATING, METHOD OF ELECTROLESS PLATING USING THE SAME AND PRODUCT OF ELECTROLESS PLATING |
摘要 |
<p>A pretreating agent for electroless plating that is soluble in organic solvents and is stable; a method of electroless plating realizing excellent adhesion wherein use is made of the pretreating agent; and a product of electroless plating. Plating object is pretreated with a pretreating agent for electroless plating, comprising a noble metal soap of C5-C25 fatty acid, preferably further comprising a silane coupling agent with metal trapping capability, such as an imidazole silane coupling agent, and subjected to electroless plating. Palladium soap is preferably used as the noble metal soap.</p> |
申请公布号 |
WO2005073431(A1) |
申请公布日期 |
2005.08.11 |
申请号 |
WO2004JP16764 |
申请日期 |
2004.11.11 |
申请人 |
NIKKO MATERIALS CO., LTD.;KAWAMURA, TOSHIFUMI;SUZUKI, JUN;IMORI, TORU |
发明人 |
KAWAMURA, TOSHIFUMI;SUZUKI, JUN;IMORI, TORU |
分类号 |
C23C18/18;C23C18/28;(IPC1-7):C23C18/18 |
主分类号 |
C23C18/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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